PRESSURE-SENSITIVE HOT-MELT ADHESIVES ADHERING TO FLEXIBLE SUBSTRATES
A description is given of a pressure-sensitive hot-melt adhesive which fe atures good low-temperature adhesion. The adhesive is used to bond film subs trates to one another or to cardboard packaging. The adhesive is to contain 2% to 50% of styrene block copolymers, 1% to 30% of EVA polymers, and als...
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Main Authors | , , , |
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Format | Patent |
Language | English French |
Published |
22.05.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A description is given of a pressure-sensitive hot-melt adhesive which fe atures good low-temperature adhesion. The adhesive is used to bond film subs trates to one another or to cardboard packaging. The adhesive is to contain 2% to 50% of styrene block copolymers, 1% to 30% of EVA polymers, and also 2 0% to 70% of tackifying resins and 5% to 40% of plasticizer. Suitability is possessed more particularly by mixtures with SIBS polymer. |
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Bibliography: | Application Number: CA20072669769 |