PRESSURE-SENSITIVE HOT-MELT ADHESIVES ADHERING TO FLEXIBLE SUBSTRATES

A description is given of a pressure-sensitive hot-melt adhesive which fe atures good low-temperature adhesion. The adhesive is used to bond film subs trates to one another or to cardboard packaging. The adhesive is to contain 2% to 50% of styrene block copolymers, 1% to 30% of EVA polymers, and als...

Full description

Saved in:
Bibliographic Details
Main Authors TOENNIESSEN, HOLGER, SEILER, ANNIE, RAUBERGER, RAINER, GRAUEL, RALF
Format Patent
LanguageEnglish
French
Published 22.05.2008
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
Online AccessGet full text

Cover

More Information
Summary:A description is given of a pressure-sensitive hot-melt adhesive which fe atures good low-temperature adhesion. The adhesive is used to bond film subs trates to one another or to cardboard packaging. The adhesive is to contain 2% to 50% of styrene block copolymers, 1% to 30% of EVA polymers, and also 2 0% to 70% of tackifying resins and 5% to 40% of plasticizer. Suitability is possessed more particularly by mixtures with SIBS polymer.
Bibliography:Application Number: CA20072669769