PROCESS AND APPARATUS FOR THE MANUFACTURE OF A SPUTTERING TARGET

• Main Authors: JUREWICZ, JERZY W, BOULOS, MAHER I
• Format: Patent
• Language: English; French
• Published: 02.09.2004
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A process for the manufacture of sputtering target comprises the steps of i) providing a substrate; ii) plasma melting of a material selected to form the sputtering target, yielding droplets of molten material; and iii) deposition of the droplets onto the substrate, yielding a sputtering target comprised of the coated layer of the material on the substrate. In some application, it might be preferable that the substrate be a temporary substrate and iv) to join the coated temporary target via its coated layer to a permanent target backing material; and v) to remove the temporary substrate, yielding a sputtering target comprised of the coated layer of the material on the permanent target backing material. The plasma deposition step is carried out at atmospheric pressure or under soft vacuum conditions using, for example, d.c. plasma spraying, d.c. transferred arc deposition or induction plasma spraying. The process is simple and does not require subsequent operation on the resulting target.