CURABLE RESIN COMPOSITION

A curing resin composition obtained by reacting an epoxy resin with a (meth)acrylic anhydride is disclosed which is a solid resin at ordinary temperatures. The curing resin composition contains an unsaturated resin carrying a (meth)acryloyl group (A) which has a double-bond equivalent weight of 200-...

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Bibliographic Details
Main Authors HARADA, TETSUYA, TOMIYAMA, TAKASHI, YASUMURA, TAKASHI
Format Patent
LanguageEnglish
French
Published 05.06.2012
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A curing resin composition obtained by reacting an epoxy resin with a (meth)acrylic anhydride is disclosed which is a solid resin at ordinary temperatures. The curing resin composition contains an unsaturated resin carrying a (meth)acryloyl group (A) which has a double-bond equivalent weight of 200-500, an ester number of 100-300 and a hydroxyl number of 130 or less, an ethylenically unsaturated monomer (B), and a radical polymerization initiator (C).
Bibliography:Application Number: CA20042523755