CURABLE RESIN COMPOSITION
A curing resin composition obtained by reacting an epoxy resin with a (meth)acrylic anhydride is disclosed which is a solid resin at ordinary temperatures. The curing resin composition contains an unsaturated resin carrying a (meth)acryloyl group (A) which has a double-bond equivalent weight of 200-...
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Main Authors | , , |
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Format | Patent |
Language | English French |
Published |
05.06.2012
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Subjects | |
Online Access | Get full text |
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Summary: | A curing resin composition obtained by reacting an epoxy resin with a (meth)acrylic anhydride is disclosed which is a solid resin at ordinary temperatures. The curing resin composition contains an unsaturated resin carrying a (meth)acryloyl group (A) which has a double-bond equivalent weight of 200-500, an ester number of 100-300 and a hydroxyl number of 130 or less, an ethylenically unsaturated monomer (B), and a radical polymerization initiator (C). |
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Bibliography: | Application Number: CA20042523755 |