ELASTOMER MODIFIED POLYAMIDES FOR IMPROVING THE BREAKING RESISTANCE OF FILMS AND HOLLOW ELEMENTS

The invention relates to molded flexible polyamide materials containing polyamide and olefin/vinyl acetate copolymers, films and hollow elements comprising at least one layer of said molded materials, and methods for producing the molded materials, films, and hollow elements.

Saved in:
Bibliographic Details
Main Authors MAHLKE, MATTHIAS, SCHULTE, HELMUT, PARG, ROLAND, ULRICH, RALF, HOCH, MARTIN, SCHWARZ, PETER, SCHAEFER, MARCUS
Format Patent
LanguageEnglish
French
Published 01.04.2004
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:The invention relates to molded flexible polyamide materials containing polyamide and olefin/vinyl acetate copolymers, films and hollow elements comprising at least one layer of said molded materials, and methods for producing the molded materials, films, and hollow elements.
Bibliography:Application Number: CA20032496087