ABRASIVE ARTICLE HAVING A WINDOW SYSTEM FOR POLISHING WAFERS, AND METHODS

A process for planarizing, polishing, or providing other modification of a wafer surface (22) or other workpiece. The process includes using an abrasive article (140) having a textured abrasive coating affixed (146) to a backing. The abrasive article includes a monitoring element, such as a window (...

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Main Authors BRUXVOORT, WESLEY J, PENDERGRASS, DANIEL B, FIZEL, JERRY J, MUILENBURG, MICHAEL J, STREIFEL, ROBERT J, KIM, CHONG YONG, GAGLIARDI, JOHN J, WEBB, RICHARD J
Format Patent
LanguageEnglish
French
Published 06.06.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:A process for planarizing, polishing, or providing other modification of a wafer surface (22) or other workpiece. The process includes using an abrasive article (140) having a textured abrasive coating affixed (146) to a backing. The abrasive article includes a monitoring element, such as a window (148), to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
Bibliography:Application Number: CA20012430377