SILVER CONTAINING COPPER ALLOY
A copper that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, fr om 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper an inervitable impurities has high strength, a yield streng...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French |
Published |
14.02.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A copper that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, fr om 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper an inervitable impurities has high strength, a yield strength in excess of 552 MPa, and high electrical conductivity, in excess of 80% IAC S. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal (14) above 850 ~C and susequent cold rolling (20) into sheet, strip of foil interspersed by bell annealing (22). As a result, the alloy is particularly suited for forming in to box-type electrical connectors for both automotive or multimedia application s. The alloy is also suitable for forming into a rod, wire or section. |
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Bibliography: | Application Number: CA20012416574 |