MOUNTING METHOD AND APPARATUS FOR ELECTRICAL COMPONENTS

A heat sink (12) is formed from a base component (14) and a clamping compone nt (16). The base component (14) and clamping component (16) include a locking groove (18) and a tab (20) for insertion into the locking groove (18). The clamping component (16) includes at least one clamping leg (22). The...

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Bibliographic Details
Main Author GUTHRIE, BRIAN S
Format Patent
LanguageEnglish
French
Published 08.02.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A heat sink (12) is formed from a base component (14) and a clamping compone nt (16). The base component (14) and clamping component (16) include a locking groove (18) and a tab (20) for insertion into the locking groove (18). The clamping component (16) includes at least one clamping leg (22). The base component (14) includes a surface (24). The clamping leg (22) is designed to snap over the surface (24) to couple the two components (14, 16) together an d capture between them in heat conducting relationship with at least one of th e components (14, 16) at least one device (10-1, ... 10-n) which evolves heat during its operation.
Bibliography:Application Number: CA20002377336