METHOD OF MODIFYING A SURFACE OF A STRUCTURED WAFER

A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first phase and a second phase, the first phase being harder than the se...

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Bibliographic Details
Main Author PENDERGRASS, DANIEL B., JR
Format Patent
LanguageEnglish
French
Published 14.12.2000
Edition7
Subjects
ADHESIVES
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GENERAL PROCESSES OF COMPOUNDING
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
WORKING-UP
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Summary:A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first phase and a second phase, the first phase being harder than the second phase; and (b) relatively moving the surface to be modified and the fixed abrasive article to remove material from the surface to be modified in the absence of an abrasive slurry.
Bibliography:Application Number: CA19992374004