COMPACT POST-MOLD COOLING DEVICE

• Main Authors: OUESLATI, FAISAL, OLARU, GHEORGHE, NETER, WITOLD
• Format: Patent
• Language: English; French
• Published: 10.02.2000
• Edition: 6
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention relates to a multi-stage, post-mold cooling method and apparatus used in conjunction with an injection molding machine having an aggressive cycle time and a high output. The apparatus of the present invention includes a thermal conditioning device/station (36) with cooling tubes (62) for keeping separate the preforms (28) of each batch and effectin g cooling of the molded preforms (28), several separated cooling levels (60) f or simultaneously cooling multiple batches of preforms (28), and internal devic es (64) for automatically transferring each batch of molded preforms (28) from one cooling level (60) to the next. In a preferred embodiment, the thermal conditioning device/station (36) is partially sealed to create a controlled temperature environment for conditioning the molded articles. In another embodiment, the thermal conditioning device/station (36) includes a level fo r re-heating the preforms (28). The present invention relates to a multi-stage, post-mold cooling method and apparatus used in conjunction with an injection molding machine having an aggressive cycle time and a high output. The apparatus of the present invention includes a thermal conditioning device/station (36) with cooling tubes (62) for keeping separate the preforms (28) of each batch and effecting cooling of the molded preforms (28), several separated cooling levels (60) for simultaneously cooling multiple batches of preforms (28), and internal devices (64) for automatically transferring each batch of molded preforms (28) from one cooling level (60) to the next. In a preferred embodiment, the thermal conditioning device/station (36) is partially sealed to create a controlled temperature environment for conditioning the molded articles. In another embodiment, the thermal conditioning device/station (36) includes a level for re-heating the preforms (28).