INTEGRATED CIRCUIT MICROSATELLITE

A plurality of silicon and GaAs wafers (32) each including integrated circuitry for providing particular functions for each wafer are mounted with in a housing (19) in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opp...

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Bibliographic Details
Main Author JOSHI, ABHAY M
Format Patent
LanguageEnglish
French
Published 22.10.2002
Edition6
Subjects
AIRCRAFT
ANTENNAS, i.e. RADIO AERIALS
AVIATION
BASIC ELECTRIC ELEMENTS
COSMONAUTICS
ELECTRICITY
PERFORMING OPERATIONS
TRANSPORTING
VEHICLES OR EQUIPMENT THEREFOR
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Summary:A plurality of silicon and GaAs wafers (32) each including integrated circuitry for providing particular functions for each wafer are mounted with in a housing (19) in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtaine d for use amongst other things in microsatellites (2).
Bibliography:Application Number: CA19982306838