METHOD AND DEVICE FOR MAKING A THIN LAYER COMPOSITE UNIMORPHFERROELECTRIC DRIVER AND SENSOR

A method for forming ferroelectric wafers (10) is provided. A prestress laye r (14) is placed on the desired mold. A ferroelectric wafer (12) is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may...

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Bibliographic Details
Main Authors FOX, ROBERT L, BRYANT, ROBERT G, ROHRBACH, WAYNE W, SIMPSON, JOYCELYN O, JALINK, ANTONY, JR, HELLBAUM, RICHARD F
Format Patent
LanguageEnglish
French
Published 10.01.2006
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Summary:A method for forming ferroelectric wafers (10) is provided. A prestress laye r (14) is placed on the desired mold. A ferroelectric wafer (12) is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.
Bibliography:Application Number: CA19962217472