MOUNTING STRUCTURE FOR A SEMICONDUCTOR CIRCUIT
In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an e...
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Main Author | |
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Format | Patent |
Language | English French |
Published |
12.10.1997
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.
In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output. |
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Bibliography: | Application Number: CA19972202426 |