MOUNTING STRUCTURE FOR A SEMICONDUCTOR CIRCUIT

In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an e...

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Bibliographic Details
Main Author MIYOSHI, TADAYOSHI
Format Patent
LanguageEnglish
French
Published 12.10.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output. In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.
Bibliography:Application Number: CA19972202426