HIGH TEMPERATURE RESISTANT ANTISTATIC PRESSURE-SENSITIVE ADHESIVE TAPE

There is provided a heat-resistant anti-static pressure-sensitive adhesive tape comprising a substrate having opposing surfaces, at least one of said surfaces bearing thereon an acrylic microparticulate adhesive wherein the microparticles have an average diameter of 1 to 250 micrometers, wherein the...

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Bibliographic Details
Main Authors GUTMAN, GUSTAV, YAU, STEVEN D
Format Patent
LanguageEnglish
French
Published 13.03.2007
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
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Summary:There is provided a heat-resistant anti-static pressure-sensitive adhesive tape comprising a substrate having opposing surfaces, at least one of said surfaces bearing thereon an acrylic microparticulate adhesive wherein the microparticles have an average diameter of 1 to 250 micrometers, wherein the microparticles have a surface bearing thereon an ionic conductive material formed from a polymer electrolyte base polymer and at least one ionic salt selected from the group consisting of salts of alkali metals and salts of alkaline earth metals, said adhesive being bonded to said substrate by means of a primer, said primer comprising at least one phenolic resin and at least one rubbery compound, said adhesive tape being capable of surviving immersion in molten solder at 260.degree.C for at least 5 seconds.
Bibliography:Application Number: CA19952187316