SOLVENTLESS RESIN COMPOSITION HAVING MINIMAL REACTIVITY AT ROOM TEMPERATURE

• Main Author: MARKOVITZ, MARK
• Format: Patent
• Language: English; French
• Published: 12.06.2007
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

A resin composition is provided that is suitable for impregnating sheet material, including fabrics, films, paper and tapes of the type employed to form prepregs, such as tapes used to form electrical insulation layers on electrical components. The resin composition includes a solid or semi-solid epoxy resin having an epoxide functionality of at least 2.5, a metal acetylacetonate for catalyzing the epoxy resin, and an accelerator of bisphenol A- formaldehyde novolac catalyzed by an acidic catalyst and having a hydroxyl equivalent weight of 120. The resin composition is essentially unreactive at room temperature and at elevated temperatures sufficient to enable permeation of the sheet material by the resin in its manufacture, is essentially unreactive at temperatures required to remove moisture and volatiles during processing of articles wrapped or taped with the sheet material, and cures at a higher temperature without adversely affecting the cure characteristics of the resin composition. The resin composition of this invention achieves the desirable reactivity characteristics noted above, while exhibiting enhanced mechanical, thermal and electrical properties necessary for its use within an electrical insulation composite.