COOL-APPLIED HOT MELT ADHESIVE COMPOSITION

A carton, case or tray formed utilizing a hot melt adhesive composition said adhesive consisting essentially of a) 10 to 60% by weight of at least one ethylene n-butyl acrylate copolymer containing 25 to 45% by weight n-butyl acrylate and having a melt index of at least about 850; b) 20 to 60% of a...

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Bibliographic Details
Main Authors PULETTI, PAUL P, STAUFFER, DANIEL C, LIEDERMOOY, INGRID
Format Patent
LanguageEnglish
French
Published 18.07.2000
Edition6
Subjects
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Summary:A carton, case or tray formed utilizing a hot melt adhesive composition said adhesive consisting essentially of a) 10 to 60% by weight of at least one ethylene n-butyl acrylate copolymer containing 25 to 45% by weight n-butyl acrylate and having a melt index of at least about 850; b) 20 to 60% of a rosin ester tackifying resin; c) 10 to 50% by weight of a microcrystalline or paraffin wax having a melting point of 65.5 to 93.2.degree.C (150 to 200.degree.F); d) 1 to 20% by weight of a polymeric additive selected from the group consisting of ethylene vinyl acetate containing 10 to 40 % by weight vinyl acetate, ethylene methyl acrylate polymers containing 10 to 28 % methyl acrylate, ethylene acrylic acid copolymers having an acid number of 25 to 150, polyethylene, polypropylene, poly-(butene-1-co-ethylene), and lower melt index ethylene nbutyl acrylate copolymers; and e) 0 to 1.5 % stabilizer, said adhesive characterized by a viscosity of less than 3000 cps at 135.degree.C, fiber tearing bonds from within the range of -35 to 40.degree.C.
Bibliography:Application Number: CA19962166497