PROCESS FOR SINTERING ALUMINUM NITRIDE TO A HIGH THERMAL CONDUCTIVITY AND RESULTANT SINTERED BODIES

Sintered aluminium nitride bodies having a TC of at least 200 W/m.K are prepared by sintering under non-reducing conditions and controlling interrelated parameters such as binder burnout atmosphere, heating rate, sintering temperature, time at sintering temperature, cooling rate and cooling temperat...

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Bibliographic Details
Main Authors GUITON, THERESA A, MILLS, LYNNE K
Format Patent
LanguageEnglish
French
Published 13.10.1994
Edition6
Subjects
ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
LIME, MAGNESIA
METALLURGY
REFRACTORIES
SLAG
TREATMENT OF NATURAL STONE
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Summary:Sintered aluminium nitride bodies having a TC of at least 200 W/m.K are prepared by sintering under non-reducing conditions and controlling interrelated parameters such as binder burnout atmosphere, heating rate, sintering temperature, time at sintering temperature, cooling rate and cooling temperature. The sintered bodies may also have a TC in excess of 270 W/m.K.
Bibliography:Application Number: CA19942155836