MULTI-LAYER CERAMIC SUBSTRATE WITH SOLDER DAM ON CONNECTING PATTERN

• Main Author: SATOU, KAZUAKI
• Format: Patent
• Language: English; French
• Published: 22.02.1994
• Edition: 5
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A MULTI-LAYER CERAMIC SUBSTRATE ASSEMBLY AND A PROCESS FOR MANUFACTURING SAME ABSTRACT OF THE DISCLOSURE A multi-layer ceramic substrate assembly comprising a multi-layer ceramic substrate including a via-conductor and an interconnecting line and having a surface, a first soldering pad on the surface of the substrate and connected to the via-conductor, a second soldering pad on the surface of the substrate adjacent to the first soldering pad, a connecting pattern on the surface of the substrate for connecting the first and second soldering pads, the connecting pattern being made of an electric conductor wettable with a solder, and a solder dam formed on the connecting pattern between the first and second soldering pads, the solder dam being made of a metal or a metal alloy or compound not wettable with a solder. The electric conductivity of the connecting pattern is carried by a metal having a good electric conductivity and the solder dam is made of a metal or a metal alloy or compound not wettable with a solder, whereby the solder dam stops a flow of a solder through the dam or under the dam. A simple and reliable process for forming such a solder dam is also provided.