ENCAPSULATION OF ELECTRONIC COMPONENTS WITH CALCIUM SILICATE-CONTAINING POLY(ARYLENE SULFIDE) COMPOSITIONS

Abstract of the Disclosure Electronic components are encapsulated with a calcium silicate-containing poly(arylene sulfide) composition. The composition can also contain a filler such as talc or silica and an organosilane such as 3-mercaptopropyltrimethoxysilane.

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Bibliographic Details
Main Author DIX, JAMES S
Format Patent
LanguageEnglish
French
Published 26.04.1988
Edition4
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
RESISTORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Abstract of the Disclosure Electronic components are encapsulated with a calcium silicate-containing poly(arylene sulfide) composition. The composition can also contain a filler such as talc or silica and an organosilane such as 3-mercaptopropyltrimethoxysilane.
Bibliography:Application Number: CA19830434629