COPPER PHYSICAL DEVELOPMENT USING HETEROCYCLIC LIGAND COPPER(I) COMPLEXES

Copper physical development using certain heterocyclic ligand copper(I) complexes which are resistant to aerial oxidation is disclosed. The copper(I) complexes can be represented by the formula L(CuX)m wherein L is a monodentate or bidentate heterocyclic ligand, X is an anion and m is the integer l...

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Bibliographic Details
Main Author VINAL, RICHARD S
Format Patent
LanguageEnglish
French
Published 02.11.1982
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Summary:Copper physical development using certain heterocyclic ligand copper(I) complexes which are resistant to aerial oxidation is disclosed. The copper(I) complexes can be represented by the formula L(CuX)m wherein L is a monodentate or bidentate heterocyclic ligand, X is an anion and m is the integer l or 2. The described physical development compositions can operate in either the disproportionation mode, in which case the composition further comprises, in addition to the copper(I) complex, a ligand for copper(II); or in the reduction mode, in which case the composition further comprises a reducing agent and preferably a tase. Generally, nuclei of metals from group VIII and IB of the periodic table are catalytic for the deposition of copper from these compositions. The nuclei can be imagewise formed by exposing an electromagnetic radiation sensitive compound. Physical development formulations, processes and elements are disclosed.
Bibliography:Application Number: CA19780309252