PROCESSO PARA REMOÇÃO DE SOLVENTE DE FIAÇÃO RESIDUAL DE UM FILAMENTO FIADO EM ESTADO DE GEL, O FILAMENTO, FIO COM MULTIFILAMENTOS E PRODUTOS COMPREENDENDO O FILAMENTO
Processes for removing residual spin solvent from a gel spun, UHMwPE filament having an effective diameter of above 16 μm, comprise the steps of removing residual spin solvent from the filament to a level of below 100 ppm at elevated temperature, while keeping the filament taut. Gel spun UHMwPE fila...
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Main Authors | , , , , |
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Format | Patent |
Language | Portuguese |
Published |
09.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Processes for removing residual spin solvent from a gel spun, UHMwPE filament having an effective diameter of above 16 μm, comprise the steps of removing residual spin solvent from the filament to a level of below 100 ppm at elevated temperature, while keeping the filament taut. Gel spun UHMwPE filaments having an effective diameter of above 16 μm and a residual spin solvent residue of less than 100 ppm are also provided. Preferably the filament has a creep rate, measured at 50° C., under a load, so that the initial stress is 600 MPa, of less than 5·10−6 sec−1. |
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Bibliography: | Application Number: BR2008PI09426 |