PROCESSO PARA REMOÇÃO DE SOLVENTE DE FIAÇÃO RESIDUAL DE UM FILAMENTO FIADO EM ESTADO DE GEL, O FILAMENTO, FIO COM MULTIFILAMENTOS E PRODUTOS COMPREENDENDO O FILAMENTO

Processes for removing residual spin solvent from a gel spun, UHMwPE filament having an effective diameter of above 16 μm, comprise the steps of removing residual spin solvent from the filament to a level of below 100 ppm at elevated temperature, while keeping the filament taut. Gel spun UHMwPE fila...

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Main Authors CLAUDIA MARIA VAZ, CARINA SACHA SNIJDER, ROELOF MARISSEN, LEONARD JOSEF ARNOLD NIELABA, JOSEPH ARNOLD PAUL MARIA SIMMELINK
Format Patent
LanguagePortuguese
Published 09.09.2014
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Summary:Processes for removing residual spin solvent from a gel spun, UHMwPE filament having an effective diameter of above 16 μm, comprise the steps of removing residual spin solvent from the filament to a level of below 100 ppm at elevated temperature, while keeping the filament taut. Gel spun UHMwPE filaments having an effective diameter of above 16 μm and a residual spin solvent residue of less than 100 ppm are also provided. Preferably the filament has a creep rate, measured at 50° C., under a load, so that the initial stress is 600 MPa, of less than 5·10−6 sec−1.
Bibliography:Application Number: BR2008PI09426