conjunto de blindagem para blindar circuito eletrÈnico disposto em substrato e dispositivo de comunicação tendo um alojamento

A shielding assembly (102) for shielding an electronic circuit (108) disposed on a substrate (107) includes traces (118) and a shield (200). The traces (118) are disposed on the substrate (107) about the electronic circuit (108). The shield (200) includes leads (214, 218) for attachment to the trace...

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Bibliographic Details
Main Authors JOHN F. HANNON, SCOTT W. MATUSZEWSKI, MARTIN J. KIMBELL, JIN W. LEE
Format Patent
LanguagePortuguese
Published 10.08.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TRANSMISSION
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Summary:A shielding assembly (102) for shielding an electronic circuit (108) disposed on a substrate (107) includes traces (118) and a shield (200). The traces (118) are disposed on the substrate (107) about the electronic circuit (108). The shield (200) includes leads (214, 218) for attachment to the traces (118). The shield (200) is attached to the traces (118) such that some of the leads (218), which are staggered, attach to the traces (118) in a nonconsecutive manner. An additional shield (201) including alternately staggered leads (222) can be adjacently attached to the previously attached shield (200). This is accomplished by attaching the alternately staggered leads (222) of the additional shield (201) to those traces that are between the traces attached to the previously attached shield (200).
Bibliography:Application Number: BR19969603472