módulo eletrônico

• Main Authors: GÜNTHER KRAFT, KRUNOSLAC ORCIC, DIDIER BERTHOMIER, THOMAS SCHIEMANN, VALOD NOSHADI
• Format: Patent
• Language: Portuguese
• Published: 01.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

um módulo eletrônico (40) é fornecido que inclui uma placa de circuito multicamada (41), e um componente eletrônico (62), e uma bomba de calor peltier (60). o componente eletrônico é montado sobre uma superfície principal da placa de circuito multicamada e é eletricamente acoplado a pelo menos uma matriz de memória (48). a pelo menos uma matriz de memória é pelo menos parcialmente incorporada dentro da placa de circuito multicamada. o dispositivo de bomba de calor peltier tem pelo menos um par de membros semicondutores termoelétricos (68, 69) dispostos termicamente em paralelo e eletricamente em série, e o pelo menos um par de membros semicondutores são pelo menos parcialmente incorporados na placa de circuito. An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.