polìmero de poli(estireno-butadieno-estireno), e, composição adesiva termorreversìvel

The present invention concerns a poly(styrene-butadiene-styrene) polymer having a high vinyl content in the butadiene block comprising in combination a polystyrene content (PSC) within a range of 15-20 % by weight, a coupling efficiency (CE) of 50-80 %, a step I molecular weight (MW) between 9,000 a...

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Bibliographic Details
Main Authors BIRGITTE M. L. VAN DE VLIET, JEFFREY G. SOUTHWICK, GEERT E. A. VERMUNICHT
Format Patent
LanguagePortuguese
Published 10.07.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention concerns a poly(styrene-butadiene-styrene) polymer having a high vinyl content in the butadiene block comprising in combination a polystyrene content (PSC) within a range of 15-20 % by weight, a coupling efficiency (CE) of 50-80 %, a step I molecular weight (MW) between 9,000 and 10,000 kg/mol, and a vinyl content between 20-45 %. Hot melt adhesive compositions are also described comprising said SBS polymer together with a tackifying resin, a plasticizer and an anti-oxidant.
Bibliography:Application Number: BR20030308687