COMPOSITE FOAMS OF LOW THERMAL CONDUCTIVITY

A composite foam of low thermal conductivity comprises a) 20-80% by volume of silica aerogel particles having a mean diameter of from 0.1 to 20 mm and a density of from 0.08 to 0.40 g/cm3, b) 20-80% by volume of a styrene polymer foam which surrounds the particles of component a) and binds them to o...

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Bibliographic Details
Main Authors BERNARDO WOLFF, GUENTHER SEYBOLD, FRIEDER HOHWILLER
Format Patent
LanguageEnglish
Published 11.06.1992
Edition5
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:A composite foam of low thermal conductivity comprises a) 20-80% by volume of silica aerogel particles having a mean diameter of from 0.1 to 20 mm and a density of from 0.08 to 0.40 g/cm3, b) 20-80% by volume of a styrene polymer foam which surrounds the particles of component a) and binds them to one another and has a density of from 0.01 to 0.15 g/cm3, and, if desired, c) conventional additives in effective amounts.
Bibliography:Application Number: AU19910088389