An improved process for sintering aluminum nitride to a high thermal conductivity and resultant sintered bodies

Prepare sintered aluminum nitride bodies having a thermal conductivity of at least 200 W/m-K by sintering under non-reducing conditions and controlling interrelated parameters such as binder burnout atmosphere, heating rate, sintering temperature, time at sintering temperature, cooling rate and cool...

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Bibliographic Details
Main Authors THERESA A GUITON, LYNNE K MILLS
Format Patent
LanguageEnglish
Published 24.10.1994
Edition5
Subjects
ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
LIME, MAGNESIA
METALLURGY
REFRACTORIES
SLAG
TREATMENT OF NATURAL STONE
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Summary:Prepare sintered aluminum nitride bodies having a thermal conductivity of at least 200 W/m-K by sintering under non-reducing conditions and controlling interrelated parameters such as binder burnout atmosphere, heating rate, sintering temperature, time at sintering temperature, cooling rate and cooling temperature. Sintered bodies having thermal conductivities in excess of 200, especially in excess of 270, W/m-K result from this process.
Bibliography:Application Number: AU19940063925