Pressure sensitive adhesive tape

The present invention relates to a pressure sensitive adhesive tape comprising at least one pressure sensitive adhesive layer that is capable of being cured upon exposure to actinic radiation or electron beam radiation and comprises: (i) an epoxy containing material; (ii) an amorphous and branched p...

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Bibliographic Details
Main Authors SUSANNE H. RIEDER-OTTERBURG, GREGGORY S BENNETT, ALAIN H. LAMON, SIEGFRIED K. WELKE
Format Patent
LanguageEnglish
Published 25.08.2000
Edition7
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention relates to a pressure sensitive adhesive tape comprising at least one pressure sensitive adhesive layer that is capable of being cured upon exposure to actinic radiation or electron beam radiation and comprises: (i) an epoxy containing material; (ii) an amorphous and branched polyester having a glass transition temperature of not more than 10 DEG C; (iii) and an effective amount of a photoinitiator when needed to initiate the curing. According to a method provided by this invention, the pressure sensitive adhesive tape can be used to join two substrates and create assemblies with excellent mechanical properties.
Bibliography:Application Number: AU2714900