MICRONEEDLE ASSEMBLY
An embodiment of the present invention provides a microneedle assembly comprising: a mold having one or more engraved portions in the upper surface thereof and a microneedle which is injected into the engraved portions and molded; and an applicator which is detachably coupled to the upper surface of...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
30.05.2024
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Subjects | |
Online Access | Get full text |
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Summary: | An embodiment of the present invention provides a microneedle assembly comprising: a mold having one or more engraved portions in the upper surface thereof and a microneedle which is injected into the engraved portions and molded; and an applicator which is detachably coupled to the upper surface of the mold, wherein the applicator is formed as a plate shape, and comprises a first surface which protects the microneedle from being exposed during packaging, and a second surface on which an adhesive portion is formed, the adhesive portion being attached to the microneedle and isolating the microneedle from the mold during use. |
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Bibliography: | Application Number: AU20220405961 |