MICRONEEDLE ASSEMBLY

An embodiment of the present invention provides a microneedle assembly comprising: a mold having one or more engraved portions in the upper surface thereof and a microneedle which is injected into the engraved portions and molded; and an applicator which is detachably coupled to the upper surface of...

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Bibliographic Details
Main Authors EUM, Jae Hong, KIM, Dong Hwan, KANG, Yoon Sik, IM, Ji Yeon, KANG, Bok Ki, LEE, Boo Yong
Format Patent
LanguageEnglish
Published 30.05.2024
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Summary:An embodiment of the present invention provides a microneedle assembly comprising: a mold having one or more engraved portions in the upper surface thereof and a microneedle which is injected into the engraved portions and molded; and an applicator which is detachably coupled to the upper surface of the mold, wherein the applicator is formed as a plate shape, and comprises a first surface which protects the microneedle from being exposed during packaging, and a second surface on which an adhesive portion is formed, the adhesive portion being attached to the microneedle and isolating the microneedle from the mold during use.
Bibliography:Application Number: AU20220405961