Thermal management systems for wearable components

In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal commun...

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Bibliographic Details
Main Authors Woods, Michael Janusz, Greco, Paul M
Format Patent
LanguageEnglish
Published 01.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.
Bibliography:Application Number: AU20170361096