Epoxy resin

The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite mat...

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Bibliographic Details
Main Authors Dao, Nguyen Buu, Christensen, Stephen, Varley, Russell John, Wiggins, Jeffrey, Tucker, Samuel, Tian, Wendy Wenjun
Format Patent
LanguageEnglish
Published 14.02.2019
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
HETEROCYCLIC COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC CHEMISTRY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.
Bibliography:Application Number: AU20170301100