Method for producing a single-sided electronic module including interconnection zones

The invention relates to a method for producing a module (17) having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method...

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Bibliographic Details
Main Authors Dossetto, Lucile, Laviron, Thierry, Ottobon, Stephane, Charles, Luc
Format Patent
LanguageEnglish
Published 31.01.2019
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Summary:The invention relates to a method for producing a module (17) having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method is characterised in that it comprises the step of forming electrical interconnection elements (9C, 9C, 30) which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.
Bibliography:Application Number: AU20160221971