Overmolded contact wafer and connector
A contact wafer that has a plurality of contacts. Each of the contacts has a body portion with a mating end and an opposite tail end. The mating end is configured to couple to a mating contact and the tail end is configured to engage a printed circuit board. An overmold surrounds the body portions o...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
04.03.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A contact wafer that has a plurality of contacts. Each of the contacts has a body portion with a mating end and an opposite tail end. The mating end is configured to couple to a mating contact and the tail end is configured to engage a printed circuit board. An overmold surrounds the body portions of the contacts such that the mating ends and the tails ends of the contacts are exposed and extend from opposite ends of said overmold. The overmold has a first side that includes a plurality of recessed surfaces. Each recessed surface is between adjacent body portions of the contacts and sized to receive a corresponding portion of an overmold of another contact wafer. |
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Bibliography: | Application Number: AU20150312015 |