Microchannel coil manifold system

• Main Author: TROUTMAN, STEPHEN
• Format: Patent
• Language: English
• Published: 02.02.2012
• Subjects: BLASTING; COMBINED HEATING AND REFRIGERATION SYSTEMS; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HEAT EXCHANGE IN GENERAL; HEAT PUMP SYSTEMS; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; REFRIGERATION MACHINES, PLANTS OR SYSTEMS; REFRIGERATION OR COOLING; STEAM OR VAPOUR CONDENSERS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; WEAPONS

The present application provides a microchannel coil manifold system. The microchannel coil manifold system may include a number of assembly inlet manifold sections that terminate in a first stub tube, a number of assembly outlet manifold sections that terminate in a second stub tube, and one or more microchannel coils. Each pair of assembly inlet and outlet manifold sections may be in communication with the one or more microchannel coils.