Radiation cross-linkable hot-melt contact adhesives

The invention relates to a radiation cross-linkable hot-melt contact adhesive based on: radiation cross-linkable epoxidized polyolefins, the epoxy groups being distributed, in essence, over the polymer chain; a constituent (B) provided in the form of a tackifying resin that does not contain any epox...

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Bibliographic Details
Main Authors TONNIESSEN, HOLGER, MOLLER, THOMAS
Format Patent
LanguageEnglish
Published 19.04.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention relates to a radiation cross-linkable hot-melt contact adhesive based on: radiation cross-linkable epoxidized polyolefins, the epoxy groups being distributed, in essence, over the polymer chain; a constituent (B) provided in the form of a tackifying resin that does not contain any epoxy groups, and optionally; an oligomeric compound (C) that has reactive groups, which can react with the epoxy groups of constituent (A), together with at least one photinitiator and other additives.
Bibliography:Application Number: AU20060212536