Light emitting diode component

A light emitting package (8, 8', 8", 208, 408) includes a printed circuit board (10, 10', 10", 210, 410) supporting at least one light emitting die (12, 12", 14, 16, 212, 412). A light transmissive cover (60, 60', 60", 260, 460) is disposed over the at least one li...

Full description

Saved in:
Bibliographic Details
Main Authors AANEGOLA, SRINATH K, WEAVER, STANTON E. JR, RADKOV, EMIL, PETROSKI, JAMES T
Format Patent
LanguageEnglish
Published 06.10.2011
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A light emitting package (8, 8', 8", 208, 408) includes a printed circuit board (10, 10', 10", 210, 410) supporting at least one light emitting die (12, 12", 14, 16, 212, 412). A light transmissive cover (60, 60', 60", 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62', 62", 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70", 270, 470) containing the at least one light emitting die. An encapsulant (76, 76", 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
Bibliography:Application Number: AU20050239406