THINNER COMPOSITION FOR REMOVING PHOTOSENSITIVE RESIN

• Main Authors: SANG-DAI LEE, WOO-SIK JUN, SOON-HEE PARK
• Format: Patent
• Language: English
• Published: 13.10.2003
• Edition: 7
• Subjects: ADHESIVES; ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES; APPARATUS SPECIALLY ADAPTED THEREFOR; CANDLES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DETERGENT COMPOSITIONS; DETERGENTS; DYES; ELECTROGRAPHY; FATTY ACIDS THEREFROM; FILLING PASTES; HOLOGRAPHY; INKS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; RECOVERY OF GLYCEROL; RESIN SOAPS; SOAP OR SOAP-MAKING; USE OF MATERIALS THEREFOR; USE OF SINGLE SUBSTANCES AS DETERGENTS; WOODSTAINS

The present invention relates to a thinner composition for removing photosensitive resin, which is used in manufacture processes of semiconductor devices and liquid crystal display devices. The present invention provides a thinner composition comprising propyleneglycol monoalkyl ether acetate, cycloketone, polyethylene based condensate and fluorinated acrylic copolymer.