ORGANIC COMPOSITIONS

• Main Authors: KREISLER LAU, SLEIMAN NASSRIN, RUSLAN ZHEREBIN, AMAUEL GEBREBRHAN, BORIS KOROLEV, NANCY IWAMOTO, JOHN, G. SIKONIA, CHAN-EN LI, ANNATH NAMAN, PAUL, G. APEN
• Format: Patent
• Language: English
• Published: 30.07.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention provides a composition comprising: a dielectric material and b porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising a thermosetting component comprising 1 optionally monomer of Formula I as set forth below and 2 at least one oligomer or polymer of Formula 11 as set forth below where Q, G, h, I, I, and w are as set forth below and b porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly 2-vinyl naphthalene, vinyl anthracene, 1s polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.