Lateral soi field-effect transistor
A thin film lateral SOI device comprises a substrate and a buried oxide layer (4) (BOx) as a dielectric layer on the substrate; a silicon layer (6) on the buried oxide layer, the silicon layer comprising a first thickness silicon region (8), a second thickness silicon region (10) having a thickness...
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Main Author | |
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Format | Patent |
Language | English |
Published |
12.05.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A thin film lateral SOI device comprises a substrate and a buried oxide layer (4) (BOx) as a dielectric layer on the substrate; a silicon layer (6) on the buried oxide layer, the silicon layer comprising a first thickness silicon region (8), a second thickness silicon region (10) having a thickness smaller than the first thickness silicon region (8) and a third thickness silicon region (12) having a thickness smaller than the second thickness silicon region (10); a dielectric layer (TOx) on top of the silicon layer (6), comprising a gate dielectric layer (18) on top of the first thickness silicon region (8), a field dielectric layer (20) on top of the a second thickness silicon region (10), the field dielectric layer (20) having a thickness larger than the thickness of the gate dielectric layer (18), and a drift dielectric layer (22) on top of the third thickness silicon region (12) the drift dielectric layer (22) having a thickness larger than the thickness of the drift dielectric layer (20); a gate (42) on top of the gate dielectric layer (18) above a channel region (38); a field plate (44) extending across the field dielectric layer (20); a drain (30) laterally spaced to the third thickness silicon region (12) of the silicon layer (6); and a source (32) laterally separated from the gate. |
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Bibliography: | Application Number: AU20020339582 |