VORRICHTUNG UND VERFAHREN ZUM AUFBRINGEN VON ELEKTRONISCHEN BAUTEILEN

An electronic component disposing device for disposing an electronic component (6) formed with a solder bump (7) on a substrate (12), the electronic component disposing device comprising: a thin film forming mechanism provided with a stage (8) having a smooth plane and a squeegee (9) for spreading f...

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Bibliographic Details
Main Authors MAEDA, TADASHI, SAKAI, TADAHIKO
Format Patent
LanguageGerman
Published 15.11.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:An electronic component disposing device for disposing an electronic component (6) formed with a solder bump (7) on a substrate (12), the electronic component disposing device comprising: a thin film forming mechanism provided with a stage (8) having a smooth plane and a squeegee (9) for spreading flux (10) containing metal powder (16) in a membranous form on the smooth plane by relatively moving the squeegee (9) against the smooth plane; a pressurizing mechanism (14) for embedding the metal powder (16) on a surface of the solder bump (7) by pressing the solder bump against a portion where a thin film (10a) is formed on the smooth plane; and a disposing mechanism for positioning and disposing the solder bump (7), in a state in which the metal powder (16) is embedded, on an electrode (12a) of the substrate (12) and an electronic component disposing method.
Bibliography:Application Number: AT20060013130T