VERBACKUNGSFREIE SCHMELZKLEBSTOFFZUBEREITUNG

The invention relates to a hot-melt adhesive preparation, containing 25 to 99.5 wt. % of a thermoplastic polymer with a melting range between 40C and 250C, 0 to 40 wt. % of a resin for reinforcing the adhesive force of the preparation, 0 to 40 wt. % of a wax for regulating the viscosity of the prepa...

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Bibliographic Details
Main Authors BEHLER, ANSGAR, HERLFTERKAMP, BERNHARD
Format Patent
LanguageGerman
Published 15.09.2001
Edition7
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention relates to a hot-melt adhesive preparation, containing 25 to 99.5 wt. % of a thermoplastic polymer with a melting range between 40C and 250C, 0 to 40 wt. % of a resin for reinforcing the adhesive force of the preparation, 0 to 40 wt. % of a wax for regulating the viscosity of the preparation and 0 to 5 wt. % of additives usually used in hot-melt adhesives. According to the invention, 0.1 to 5 wt. % of a tenside is added to prevent the preparation from decomposing in dispensing and applying equipment.
Bibliography:Application Number: AT19980954455T