VERFAHREN ZUR ELEKTROLYTISCHEN ABSCHEIDUNG VON KUPFERSCHICHTEN

PCT No. PCT/EP97/06786 Sec. 371 Date Jun. 2, 1999 Sec. 102(e) Date Jun. 2, 1999 PCT Filed Dec. 4, 1997 PCT Pub. No. WO98/26114 PCT Pub. Date Jun. 18, 1998A process with the following process steps is used to electrolytically deposit copper layers, especially on printed circuit boards. An electricall...

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Bibliographic Details
Main Authors DAHMS, WOLFGANG, SENGE, GERD
Format Patent
LanguageGerman
Published 15.08.2001
Edition7
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PCT No. PCT/EP97/06786 Sec. 371 Date Jun. 2, 1999 Sec. 102(e) Date Jun. 2, 1999 PCT Filed Dec. 4, 1997 PCT Pub. No. WO98/26114 PCT Pub. Date Jun. 18, 1998A process with the following process steps is used to electrolytically deposit copper layers, especially on printed circuit boards. An electrically-conductive substrate and anodes that decompose upon electrolytic deposition are brought into contact with a deposition bath. The deposition bath contains copper ions, compounds that increase the electrical conductivity of the deposition bath, additives to influence the material properties of the copper layers, additional compounds of an electrochemically reversible redox system, and solvents or solvent mixtures. The substrate and the electrodes are connected to a power supply. The copper layers are deposited on the substrate using a pulsed current or a pulsed voltage process. When this process is used, metal layers with favorable visual and mechanical material properties are deposited after a brief bath preparation time.
Bibliography:Application Number: AT19970952879T