Narrow resonance profiling study of the oxidation of reactively sputtered Ti 1− xAl xN thin films

The bottom electrode structure used with ferroelectric (FE) and high dielectric constant (HDC) materials requires a material to promote FE or HDC cristallisation (Pt or IrO 2) and a material with diffusion barrier properties; this last material being between Pt (or IrO 2) film and Si substrate. TiN,...

Full description

Saved in:
Bibliographic Details
Published inNuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms Vol. 161; pp. 578 - 583
Main Authors Hugon, M.C, Desvignes, J.M, Agius, B, Vickridge, I.C, Kim, D.J, Kingon, A.I
Format Journal Article
LanguageEnglish
Published Elsevier B.V 2000
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The bottom electrode structure used with ferroelectric (FE) and high dielectric constant (HDC) materials requires a material to promote FE or HDC cristallisation (Pt or IrO 2) and a material with diffusion barrier properties; this last material being between Pt (or IrO 2) film and Si substrate. TiN, TiAlN and TaSiN have been proposed for diffusion applications. Ti 1− x Al x N films have drawn much attention as alternatives to TiN diffusion barriers. In this paper we have investigated the effect of Al content on the oxidation resistance of Ti 1− x Al x N films prepared by radio frequency reactive sputtering in a mixed Ar+N 2 discharge. The concentration depth profiles of both 18O and 27Al were measured before and after the rapid thermal annealing of samples at 750°C for 30 s in 18O 2, via the narrow resonances of 18O(p,α) 15N at 151 keV (fwhm=100 eV) and 27Al(p,γ) 28Si at 992 keV (fwhm=100 eV). It was found that Al incorporation in the films reduces oxide growth. The Al excitation curves indicate a uniform Al content for as deposited Ti 1− x Al x N, and reveal Al diffusion to the surface during oxidation, which indicates the formation of an Al rich oxide layer at the Ti 1− x Al x N surface. The results suggest that Ti 1− x Al x N films with x>0.39 are promising candidates as electrically conductive diffusion barrier layers.
ISSN:0168-583X
1872-9584
DOI:10.1016/S0168-583X(99)00953-2