Narrow resonance profiling study of the oxidation of reactively sputtered Ti 1− xAl xN thin films
The bottom electrode structure used with ferroelectric (FE) and high dielectric constant (HDC) materials requires a material to promote FE or HDC cristallisation (Pt or IrO 2) and a material with diffusion barrier properties; this last material being between Pt (or IrO 2) film and Si substrate. TiN,...
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Published in | Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms Vol. 161; pp. 578 - 583 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
2000
|
Subjects | |
Online Access | Get full text |
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Summary: | The bottom electrode structure used with ferroelectric (FE) and high dielectric constant (HDC) materials requires a material to promote FE or HDC cristallisation (Pt or IrO
2) and a material with diffusion barrier properties; this last material being between Pt (or IrO
2) film and Si substrate. TiN, TiAlN and TaSiN have been proposed for diffusion applications. Ti
1−
x
Al
x
N films have drawn much attention as alternatives to TiN diffusion barriers. In this paper we have investigated the effect of Al content on the oxidation resistance of Ti
1−
x
Al
x
N films prepared by radio frequency reactive sputtering in a mixed Ar+N
2 discharge. The concentration depth profiles of both
18O and
27Al were measured before and after the rapid thermal annealing of samples at 750°C for 30 s in
18O
2, via the narrow resonances of
18O(p,α)
15N at 151 keV (fwhm=100 eV) and
27Al(p,γ)
28Si at 992 keV (fwhm=100 eV). It was found that Al incorporation in the films reduces oxide growth. The Al excitation curves indicate a uniform Al content for as deposited Ti
1−
x
Al
x
N, and reveal Al diffusion to the surface during oxidation, which indicates the formation of an Al rich oxide layer at the Ti
1−
x
Al
x
N surface. The results suggest that Ti
1−
x
Al
x
N films with
x>0.39 are promising candidates as electrically conductive diffusion barrier layers. |
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ISSN: | 0168-583X 1872-9584 |
DOI: | 10.1016/S0168-583X(99)00953-2 |