Physical and chemical characterization of the surface and removal process of silicon carbide ceramics by femtosecond laser processing

Objectives: Silicon carbide ceramics, as a typical hard and brittle material, are difficult to process, with challenges such as low efficiency, significant tool wear, and poor surface quality during processing. Ultrafast laser processing can effectively inhibit the processing damage, which is an imp...

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Published inJin gang shi yu mo liao mo ju gong cheng Vol. 44; no. 4; pp. 508 - 517
Main Authors Dongqu XU, Chengyong WANG, Cezhi DU, Feng DING, Xiaoyue HU
Format Journal Article
LanguageChinese
Published Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd 01.08.2024
Subjects
ablation characteristics
femtosecond laser
micropores
removal process
sic ceramics
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Summary:Objectives: Silicon carbide ceramics, as a typical hard and brittle material, are difficult to process, with challenges such as low efficiency, significant tool wear, and poor surface quality during processing. Ultrafast laser processing can effectively inhibit the processing damage, which is an important method for the precision processing of silicon carbide ceramics. However, existing research on femtosecond laser processing of silicon carbide primarily focuses on the laser ablation characteristics of the material. The specific removal process of the material, in relation to the composition distribution and laser ablation mechanism, is still lacking in the relevant research. This paper analyzes the microstructure of the surface of silicon carbide ceramics processed by femtosecond laser pulses and its evolution law. It reveals the material removal process by examining the changes in chemical components in the ablation area, further improving the femtosecond laser processing mechanism of silicon carbide ceram
ISSN:1006-852X
DOI:10.13394/j.cnki.jgszz.2023.0088