Development of surface-texturized black silicon through metal-assisted chemical etching and its application in the thermophotovoltaic field: a review and recommendation

• Published in: Semiconductor science and technology
• Main Authors: Khairul Azri, A. A., Wan Muhamad Hatta, S. F., Abdul Wahab, Y., Islam, M. A., Mekhilef, S., Ker, P. J., Zuhdi, A. W. M.
• Format: Journal Article
• Language: English
• Published: 12.11.2024
• ISSN: 0268-1242; 1361-6641
• DOI: 10.1088/1361-6641/ad9175

Abstract The Shockley-Queisser limit poses a significant challenge in solar technology research, limiting the theoretical efficiency to around 30%. Thermophotovoltaic (TPV) systems have emerged as a solution by incorporating a thermal absorber in traditional solar cell setups to achieve total efficiency beyond the limits. The efficiency of the overall system heavily depends on the performance and quality of the thermal absorber, which absorbs photons from the heat source and transfers them to the TPV cell. However, complex and expensive fabrication processes have hindered widespread adoption of TPV technology. The well-established metal assisted chemical etching (MACE) method could be the best choice to mitigate these as it is a cost-effective, scalable, and mass-production-friendly process, which is widely used for surface texturization, creating nanostructures like nanopores, pyramids, and nanowires. MACE technique is also suitable for producing highly efficient silicon-based thermal absorbers with over 90% absorption rate, which can contribute to increased total conversion efficiency. However, it does not come without challenges such as maintaining control over the etch rate in order to achieve uniformity. This paper comprehensively reviews the utilization of MACE for fabricating silicon-based thermal absorbers in TPV systems with the range of effective wavelengths of 600 – 2000 nm which corresponds to the energy level of 0.55 – 1.85 eV. The advantages and challenges of MACE, along with characterization techniques, are extensively discussed. By providing valuable insights, this paper aims to support researchers interested in advancing TPV technology.