Thermal stress and strain in microelectronics packaging

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 34; no. 10; pp. 1694 - 1695
Main Author Stojadinović, N.D.
Format Journal Article
LanguageEnglish
Published 01.10.1994
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ISSN:0026-2714
DOI:10.1016/0026-2714(94)90055-8