Effect of Solidification Rate on Microstructure and Solid/Liquid Interface Morphology of Nie11.5 wt% Si Eutectic Alloy

In this study NieN i3 Si eutectic in situ composites are obtained by Bridgman directional solidification technique when the solidification rate varies from 6.0 mm/s to 40.0 mm/s. At the low solidification rates the lamellar spacing is decreased with increasing the solidification rate. When the solid...

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Bibliographic Details
Published in材料科学技术学报：英文版 no. 3; pp. 280 - 284
Main Author Chunjuan Cui Jun Zhang Tian Xue Lin Liu Hengzhi Fu
Format Journal Article
LanguageEnglish
Published 2015
Subjects
compos
Directional
Eutectic
situ
solidification
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Summary:In this study NieN i3 Si eutectic in situ composites are obtained by Bridgman directional solidification technique when the solidification rate varies from 6.0 mm/s to 40.0 mm/s. At the low solidification rates the lamellar spacing is decreased with increasing the solidification rate. When the solidification rate is higher than 25 mm/s, the lamellar spacing tends to be increased, because the higher undercooling makes the mass transport less effective. The adjustments of lamellar spacing are also observed during the directional solidification process, which is consistent with the minimum undercooling criterion. Moreover, the transitions from planar interface to cellular, then to dendritic interface, and finally to cellular interface morphologies with increasing velocity are observed by sudden quenching when the crystal growth tends to be stable.
Bibliography:Directional solidification Eutectic in situ compos
21-1315/TG
Chunjuan Cui;Jun Zhang;Tian Xue;Lin Liu;Hengzhi Fu;School of Metallurgical Engineering, Xi’an University of Architecture and Technology;State Key Laboratory of Solidification Processing, Northwestern Polytechnical University
In this study NieN i3 Si eutectic in situ composites are obtained by Bridgman directional solidification technique when the solidification rate varies from 6.0 mm/s to 40.0 mm/s. At the low solidification rates the lamellar spacing is decreased with increasing the solidification rate. When the solidification rate is higher than 25 mm/s, the lamellar spacing tends to be increased, because the higher undercooling makes the mass transport less effective. The adjustments of lamellar spacing are also observed during the directional solidification process, which is consistent with the minimum undercooling criterion. Moreover, the transitions from planar interface to cellular, then to dendritic interface, and finally to cellular interface morphologies with increasing velocity are observed by sudden quenching when the crystal growth tends to be stable.
ISSN:1005-0302
1941-1162