EDTA和NH_4Cl添加剂对氯化胆碱基离子液体中电沉积Zn-Ni薄膜的影响

Saved in:
Bibliographic Details
Published in中国有色金属学报：英文版 Vol. 25; no. 6; pp. 2054 - 2064
Main Author S.FASHU 谷长栋 张嘉磊 黄美玲 王秀丽 涂江平
Format Journal Article
LanguageEnglish
Published 2015
Subjects
乙二胺四乙酸（EDTA）
低共熔溶剂
氯化铵（NH4Cl）
添加剂
耐腐蚀性能
Online AccessGet full text

Cover

More Information
Bibliography:43-1239/TG
S. FASHU, Chang-dong GU, Jia-lei ZHANG, Mei-ling HUANG, Xiu-li WANG, Jiang-ping TU（ 1. State Key Laboratory of Silicon Materials, Zhejiang University, Hangzhou 310027, China; 2. Shool of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China）
Two additives of ethylene diamine tetraacetic acid （EDTA） and ammonium chloride （NH4C1） were separately used in the electrodeposition of Zn-Ni alloy films from a deep eutectic solvent. The effects of these two additives on electrodeposition behavior, composition, morphology, and corrosion performance of the Zn-Ni alloys were investigated. The electrodeposition behaviors of Zn-Ni alloy revealed by the cyclic voltammetry show that the addition of EDTA to the Zn-Ni electrolyte enhances the Zn incorporation into the alloy film while the addition of NH4C1 produces an opposite effect by suppressing Zn incorporation into the film. With an increase of EDTA concentration in the electrolyte, the Zn content of the Zn-Ni films increases, while the grain size of the deposits and the current efficiency of the plating process decrease. The increase of NH4C1 concentration in the electrolyte would significantly refine the grain size of the electrodeposited Zn-Ni films, reduce the Zn content and increase the cathodic current efficiency. The corrosion testing indicates that the barrier corrosion resistances of Zn-Ni films electrodeposited from NHnC1 containing electrolytes are superior to those electrodeposited from EDTA-containing electrolytes, which in turn are superior to those electrodeposited from additive-free electrolytes.
additive; EDTA; NH4C1; deep eutectic solvent; corrosion resistance
ISSN:1003-6326