Synthesis and characterization of imide modified poly(dimethylsiloxane) with maleopimaric acid as raw material

With the natural rosin derivative (maleopimaric acid, MPA) as the raw material, imide modified vinyl poly(dimethylsiloxane) (MP-VMS) was synthesized and characterized by ^1H NMR and ^13C NMR. The curing kinetic parameters of MP-VMS were determined by differential scanning calorimetry (DSC) at variou...

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Published in中国化学快报:英文版 no. 5; pp. 572 - 574
Main Author Tao Xu He Liu Jie Song Shi-Bin Shang Zhan-Qian Song Xiu-Jie Chen Chong Yang
Format Journal Article
LanguageEnglish
Published 2015
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Summary:With the natural rosin derivative (maleopimaric acid, MPA) as the raw material, imide modified vinyl poly(dimethylsiloxane) (MP-VMS) was synthesized and characterized by ^1H NMR and ^13C NMR. The curing kinetic parameters of MP-VMS were determined by differential scanning calorimetry (DSC) at various heating rates (5, 8, 10, 15 ℃/min) from the Kissingner, Ozawa and Crane methods. The activation energy (Ea), pre-exponential factor (A) and reaction order (n) were respectively 18.6 kJ/mol, 71,108 and 0.902. The low-temperature and high-temperature resistance of its curing product were respectively investigated by DSC and thermogravimetric analysis. The results showed that incorporation of MPA could significantly improve the thermal stability of silicone while had no effect on the low-temperature resistance, and the Tmax (the temperature corresponding to the maximum weight loss rate) increased by 70.7 ℃.
Bibliography:11-2710/O6
Maleopimaric acid lmide Polysiloxane Curing kinetics Differential scanning calorimetry (DSC)
With the natural rosin derivative (maleopimaric acid, MPA) as the raw material, imide modified vinyl poly(dimethylsiloxane) (MP-VMS) was synthesized and characterized by ^1H NMR and ^13C NMR. The curing kinetic parameters of MP-VMS were determined by differential scanning calorimetry (DSC) at various heating rates (5, 8, 10, 15 ℃/min) from the Kissingner, Ozawa and Crane methods. The activation energy (Ea), pre-exponential factor (A) and reaction order (n) were respectively 18.6 kJ/mol, 71,108 and 0.902. The low-temperature and high-temperature resistance of its curing product were respectively investigated by DSC and thermogravimetric analysis. The results showed that incorporation of MPA could significantly improve the thermal stability of silicone while had no effect on the low-temperature resistance, and the Tmax (the temperature corresponding to the maximum weight loss rate) increased by 70.7 ℃.
ISSN:1001-8417
1878-5964