5-甲基苯并三氮唑作为电腐蚀抑制剂在铜电化学机械平坦化中的应用
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Published in | 中国有色金属学报:英文版 no. 8; pp. 2431 - 2438 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
2013
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Subjects | |
Online Access | Get full text |
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Bibliography: | According to the electrochemical analysis, the corrosion inhibition efficiency of 5-methyl-lH-benzotriazole (m-BTA) is higher than that of benzotrizaole (BTA). The inhibition capability of the m-BTA passive film formed in hydroxyethylidenediphosphonic acid (HEDP) electrolyte containing both m-BTA and chloride ions is superior to that formed in m-BTA-alone electrolyte, even at a high anodic potential. The results of electrical impedance spectroscopy, nano-scratch experiments and energy dispersive analysis of X-ray (EDAX) indicate that the enhancement of m-BTA inhibition capability may be due to the increasing thickness of passive film. Furthermore, X-ray photoelectron spectrometry (XPS) analysis indicates that the increase in passive film thickness can be attributed to the incorporation of C1 into the m-BTA passive film and the formation of [Cu(I)CI(rn-BTA)], polymer film on Cu surface. Therefore, the introduction of C1- into m-BTA-containing HEDP electrolyte is effective to enhance the passivation capability of m-BTA passive film, thus extending the operating potential window. 43-1239/TG electrochemical-mechanical planarization; 5-methyl-lH-benzotriazole; corrosion inhibitor; chloride ion Yan-fei BIAN, Wen-jie ZHAI, Bao-quan ZHU School of Mechatronics Engineering, Harbin Institute of Technology, Harbin l 50001, China |
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ISSN: | 1003-6326 |